Supermicro's latest range of H12 Generation A+ Systems and Building Block Solutions® optimized for the AMD EPYC™ 7002 series processors offer new levels of application-optimized performance per watt and per dollar, that deliver outstanding core density, superior memory bandwidth, and unparalleled I/O capacity.
Both Supermicro's H11 and H12 generations of servers and motherboards are compatible with 2nd generation AMD EPYC™ processors* and can support up to DDR4-3200MHz memory. This provides a fast upgrade track and investment protection on A+ H11 gen systems for new and existing deployments, when PCI-E® 4.0 support is not a necessity.
Ansys® LS-DYNA® Performance on Supermicro BigTwin™ and AMD EPYC™ Processors Balanced compute resources, memory bandwidth, and network bandwidth deliver outstanding performance and scalability for popular crash simulation software Executive Summary Ansys® LS-DYNA® :
Simulating complex real-world problems Ansys® LS-DYNA® is a general-purpose finite element analysis program capable of simulating complex real-world problems. It is widely adopted by the automobile, aerospace, construction, military, manufacturing, and bioengineering industries. High Density, Maximized Value Compute requirements are increasing, while datacenter space is not. Supermicro’s innovative BigTwin™ family of servers, powered by AMD EPYC processors, offer incredible core density with a rich feature set. Innovative server design meets innovative CPU architecture to drive new levels of value for the datacenter. Conclusion FEA (Finite Element Analysis) workloads are demanding and require a balance of memory bandwidth, floating-point performance, and network IO. Supermicro BigTwin, empowered by AMD EPYC processors, provide exceptional memory bandwidth and floating-point performance, offering organizations the benefit of the right balance between scalability and density for their workloads.
Where performance meets efficiency for HPC applications Performance: Supports the high-performance AMD EPYC™ processors for up to 64 cores/128 threads, up to 4TB of DDR4 memory, and up to 6 hot-swap drives (4 All-Flash NVMe and 2 SATA3) per node for the most demanding workloads. Density: Incredible high-density with up to 4 hot-swappable nodes in a 2U form factor provides flexible and robust IO options – 1G, 10G, 25G, or 100G Ethernet or 100G InfiniBand, and up to 2 additional low-profile PCI-E 4.0 x16 expansion slots per node. Efficiency: Designed with power and cost efficiency in mind, BigTwin reduces power consumption with shared cooling and power design, leveraging redundant 2600W/2200W high-efficiency (96%) power supplies. (Full redundancy based on configuration and application load)