Key Applications

• Container-as-a-Service; Application Accelerator
• Diskless HPC Clusters
• All-Flash Hyperconverged Infrastructure

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 2 PCIe 4.0 x16 (LP) slot;
   • Tool-less support
   • Internal PCIe 4.0 x8 for 2 M.2 NVMe/SATA support onboard
   • Optional NVMe Boot Controller via AOC-SMG3-2M2-B
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 6 Hot-swap 2.5″ drive bays; 6 PCIe 4.0 NVMe/SAS/SATA 2.5″ drives
7. • 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
   • Liquid Cooling Support
8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Built-in SAS3 Support via Broadcom 3808; IT Mode