Key Applications

• High Performance Computing
• Enterprise Server
• Data Center Optimized
• Database Processing and High Density Storage
• Application-Optimized Solutions

Key Features

1. • Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
   • CPU TDP supports Up to 270W TDP
   • 3 UPI up to 11.2 GT/s
2. Intel® C621A Chipset
3. • Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
   • – Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
4. • 4 PCIe 4.0 x16 Low Profile (LP)
   • 1 PCIe 4.0 x8 Low Profile (LP)
   • * PCIe slot#1 is populated with 1x AOC-S3908L-H8IR-16DD-P to support 8x SAS drives
5. Dual  10GBase-T LAN with Intel® X550 Ethernet Controller
6. • 16 hotswap 2.5″ drive bays
   • 8 SAS drives wih Broadcom® 3908 Gen4 HW RAID controller for RAID  0, 1, 5, 6, 10, 50, 60
   • 8 SATA drives with Intel® C621A controller for RAID 0,1,5,10
   • 1 M.2 support:
   • – M.2 Interface: PCIe 3.0 x4
   • – M.2 Form Factor: 2260, 2280, 22110
   • – M.2 Key: M-Key
   • Optional 1 slim or 5.25″ DVD-ROM drive
   • Optional 4x hotswap 2.5″ NVMe or 2 fixed 2.5″ NVMe/SSD/HDD/SuperDOM
7. • 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control
   • 1 air shroud
8. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
9. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)