Key Applications / Features
  – Mission-critical applications
  – High Availability Storage
   Appliance Platform

Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
    2nd Gen Intel® Xeon® Scalable
    processors (Cascade Lake/Skylake)‡
2. 16 DIMMs; up to 4TB 3DS ECC
    DDR4-2933MHz† RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 slots
4. Flexible Networking support via SIOM;
    Dedicated IPMI 2.0 LAN
5. 4 Hot-swap 2.5″ SATA3 drive bays
6. 2 SuperDOM onboard or optional
    2 M.2 carrier
7. Up to 1000W Redundant Power Supplies
    Titanium Level (96%)